Via-in-pad: filled vias vs. stencil filling

In PCB designs with BGA's or fine-pitch components, it is virtually impossible to avoid vias in a pad. Filling the vias (filled vias) is then a solution to prevent solder paste from disappearing into the via through capillary action, resulting in a poor (or even no) solder joint.

A major disadvantage of PCB's with filled vias, however, is the longer production lead time.

That's why DeltaProto B.V. regularly takes a different approach: for the first ProtoPCBA, we can fill the vias ourselves using a modified stencil.

This way, you can start testing your first ProtoPCBA within 5 days.

happyEngineering