Insights

Despite preheating, the panel delaminated. And because the PCBs were still connected to each other, we could no longer process the remaining ones separately.

Test structures, mask outlines and local fiducials for reliable fine-pitch BGA assembly.

When components are designed for conductive adhesive instead of standard soldering.

Reliable and vibration-resistant, but often impractical in the prototype phase. Practical tips.

What goes wrong (and how to fix it) when making interposers for fine-pitch BGAs.

A recurring phenomenon: the standard LED orientation in the tape vs. the marking on the component.

The new ProtoMemo with PreCheck, PostCheck, and EMS advice for better prototypes.

One mistake in the measurement system and your component doesn't fit the footprint. A very common pitfall.

With BGA's or fine-pitch components, vias in a pad are unavoidable. How we shorten lead time by filling vias ourselves.